Just announced is an important addition, “Packaging in the new Millennium,” to the packaging track of the Process Expo University educational program taking place at Chicago's McCormick Place from November 3-6, 2013.
Niaz Latif, Professor and Dean of the College of Technology at Purdue University Calumet, has announced that enrollment in the Mechatronics program has increased from 22 in the Fall of 2012 to 50 in the Fall of 2013.
The Graphic Communication Institute (GrCI) at California Polytechnic State University San Luis Obispo developed and hosted a July 24 Executive Forum entitled “Innovation in Marketing Through Packaging Technology.”
From meeting with the President’s Council of Advisers on Science and Technology to presenting at this year’s Clinton Global Initiative, the Chicago-based Manufacturing Renaissance gathers a head of steam as it advocates for improved technical education in the U.S.
The GS1 Healthcare US Secure Supply Chain Task Force, consisting of more than 50 members from throughout the supply chain, developed a guideline to identify and serialize pharmaceutical products using GS1 identification numbers.