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HealthPack 2013 Louisville preview

Annual conference to help medical device packaging professionals includes two conference days and a UPS Worldhub tour.
42 Best Package Designs
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Packaging World Outstanding Senior Andrew Finley and wife Mackenzie.

Clemson student wins Packaging World award

Andrew Finley, a Clemson University Packaging Science major from Simpsonville, SC, has been awarded the 2012 Packaging World Outstanding Senior Award.
The Automation Conference is May 14-15, 2013.

PepsiCo and Perrigo to present at The Automation Conference 2013

The Automation Conference May 14-15 in Chicago will focus on technologies and strategies for driving manufacturing and packaging efficiency, and it will feature presentations by technology end-users, including PepsiCo, Perrigo, and other leading brand owners.

OMAC committees focus on streamlining standard

A recent meeting of the OMAC Packaging Working Group’s PackML and PackSpec committees concentrated on clarifying and simplifying its standard to bolster increased acceptance and use of the standard by OEMs and end users.
 B&R announces winners of PACK EXPO student competition
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B&R announces winners of PACK EXPO student competition

PMMI has an unflagging commitment to education and workforce development, and with the help of the PMMI Education and Training Foundation provided travel scholarships to 170 students and instructors coming out to PACK EXPO.
Brian Wagner (right) returned to the MSU campus to visit with his former teacher Bruce Harte and interview him for this story.
Feature Article

View from the top: MSU's Bruce Harte

Now retiring from the Michigan State School of Packaging after 34 years, Dr. Bruce Harte talks with Brian Wagner about the packaging highlights he’s seen and about his thoughts on the future.

Bill Zito Scholarship deadline is December 14

Through December 14, the 2012 Enercon Bill Zito Packaging Education Scholarship is accepting applicants through PMMI Education & Training Foundation.

Pack expo exhibitor talks about education and skill set issues

Keith Campbell speaks with a PackExpo exhibitor who reflects on customer response and on the importance of PMMI education initiatives visible at the show.

Scholarship supports next-gen packaging professionals

Packaging World and TricorBraun will donate a $2500 tuition scholarship to Missouri University of Science and Technology; The “Future Leaders in Packaging” scholarship is an annual award that is part of Summit Media Group’s Leadership in Packaging program.
PMMI First Competition

Future engineers see Pack Expo first-hand

High school student teams from the 2012 FIRST Robotics Competition get involved in packaging and processing.


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