New Products

Controls Product Brief
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Foam-in-place system

The new AccuShot 20R is a microprocessor-based, self-diagnosing foam-in-place packaging delivery system from Flexible Products (Joliet, IL) that is compact and easy to use.
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Total Cost of Ownership
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Supplier News
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Supplier news: Domestic acquisitions, agreements

Computational Systems, Inc. (Knoxville, TN) announced its CSI technical service will be renamed Paragon Services, Inc.
Controls Product Brief
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Hot melt detector

A new hot melt glue detector from SUNX Sensors (West Des Moines, IA) verifies the presence of hot melt adhesive on cartons at speeds to 1ꯠ packages/ sec.
Machine Product Brief
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Edge protectors

Pactiv Inc. (Lincolnshire, IL) has introduced the patent-pending Hexacomb® SLIC (self-locking inserting connection) edge protectors. These allow folding without the use of glue, tape or staples.
Materials Product Brief
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Biodegradable cushioning

New cornstarch-based, water-soluble sheets and planks from American Excelsior (Arlington, TX) are designed to protect and cushion end-caps, pouches, perishable food items and fragile glassware.
Materials Product Brief
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Wraparound case packer

The WRCP 2000 Series of wraparound case packers from Automation Packaging (Tampa, FL) wraps flat corrugated sheets around collated products. Compared to an RSC, the amount of corrugated board can be reduced, says the manufacturer.
Supplier News
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Supplier news: Achievements

R.A. Jones (Cincinnati, OH) won the '96 Governor's New Product Award for its PK4000 pouch machine, presented by the Kentucky Society of Professional Engineers.
Supplier News
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Supplier news: Relocations, expansions

Jefferson Smurfit Corp. (St. Louis, MO) has announced a $54.3 million capital improvement to its Brewton, AL, containerboard mill.
Supplier News
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Supplier news: Appointments, promotions

Jefferson Smurfit Group (St. Louis, MO): Richard W. Graham, president; Eric Priestley, executive vp/COO.
Controls Product Brief
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Input/output module

Turck (Minneapolis, MN) has announced the busstop(TM) input/output module for DeviceNet(TM) networks. The module is designed to connect standard input/output devices to a "bus," which is the communications system linking electrical components in a packaging line.

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