Turck (Minneapolis, MN) has announced the busstop(TM) input/output module for DeviceNet(TM) networks. The module is designed to connect standard input/output devices to a "bus," which is the communications system linking electrical components in a packaging line.
Graham Packaging (York, PA) and Lido Plast (Buenos Aires, Argentina) are forming a joint-venture called Lido Plast-Graham (Buenos Aires, Argentina) that will produce plastic packages for food, personal care, household products and auto lubricants.
The Checkmat from Krones (Franklin, WI) is now available in an X-ray version for maximum precision in fill height monitoring. The X-ray source is completely inoperative after being switched off, so no elaborate safety precautions are necessary, says Krones.