Turck (Minneapolis, MN) has announced the busstop(TM) input/output module for DeviceNet(TM) networks. The module is designed to connect standard input/output devices to a "bus," which is the communications system linking electrical components in a packaging line.
Reichhold (Research Triangle Park, NC) has released a new full-color brochure focusing on the company's commitment to the p-s adhesives market. The brochure highlights advancements in custom polymer development, its full product line in the p-s market including both hot melt and aqueous adhesives, and latest developments in on-site testing.
Graham Packaging (York, PA) and Lido Plast (Buenos Aires, Argentina) are forming a joint-venture called Lido Plast-Graham (Buenos Aires, Argentina) that will produce plastic packages for food, personal care, household products and auto lubricants.