Turck (Minneapolis, MN) has announced the busstop(TM) input/output module for DeviceNet(TM) networks. The module is designed to connect standard input/output devices to a "bus," which is the communications system linking electrical components in a packaging line.
PIAB (Hingham, MA) released a new brochure highlighting the company's line of vacuum pumps. PIAB vacuum systems are designed to perform most packaging procedures, including erecting, loading, opening, inserting, labeling, palletizing, forming and vacuum conveying.
Exxon Chemical (Houston, TX) announced that its new modified PP film resins have been approved for use in direct contact with fatty food. Previously known as HP3, OPPERA® resins are for use in oriented, cast and shrink film monolayer and multilayer constructions.
Graham Packaging (York, PA) and Lido Plast (Buenos Aires, Argentina) are forming a joint-venture called Lido Plast-Graham (Buenos Aires, Argentina) that will produce plastic packages for food, personal care, household products and auto lubricants.