John R. Nalbach Engineering Co. (Countryside, IL) has released a brochure describing its Necoflo G4 family of powder and granular fillers. The Necoflo G4 Rotary High Speed Volumetric Filler handles rigid containers from 2" to-63/16" dia at speeds from 140 to 480 cpm.
Placon (Madison, WI) has developed The Placon 2000(TM), an assembly system that packages products in clamshells or blister cards. It performs multiple packaging functions in one high-speed line, and can be custom configured to include denesting or card insertion, in-line filling, p-s labeling, sealing, overwrapping, coupon insertion, bar code testing, pick-and-place and pack out.
Barry-Wehmiller (St. Louis, MO) has acquired certain assets of Zepf Technologies (Waterloo, Ontario, Canada), whose change part and feedscrew operations will be integrated with existing B-W operations in the U.S.