Aromat (New Providence, NJ) has introduced a new line of photoelectric sensors for industrial and commercial applications. The NAiS- brand UZF-300 series of fiber-optic sensors includes a high-sensitivity model, a 1-m long-range sensing model, a green LED device and a 30 microsecond response time.
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The Checkmat from Krones (Franklin, WI) is now available in an X-ray version for maximum precision in fill height monitoring. The X-ray source is completely inoperative after being switched off, so no elaborate safety precautions are necessary, says Krones.
Turck (Minneapolis, MN) has announced the busstop(TM) input/output module for DeviceNet(TM) networks. The module is designed to connect standard input/output devices to a "bus," which is the communications system linking electrical components in a packaging line.
John R. Nalbach Engineering Co. (Countryside, IL) has released a brochure describing its Necoflo G4 family of powder and granular fillers. The Necoflo G4 Rotary High Speed Volumetric Filler handles rigid containers from 2" to-63/16" dia at speeds from 140 to 480 cpm.
Placon (Madison, WI) has developed The Placon 2000(TM), an assembly system that packages products in clamshells or blister cards. It performs multiple packaging functions in one high-speed line, and can be custom configured to include denesting or card insertion, in-line filling, p-s labeling, sealing, overwrapping, coupon insertion, bar code testing, pick-and-place and pack out.