Klockner Bartelt (Sarasota, FL) will debut the Technistar TS Series of case packers. The TS Series is the only case packer, says the company, for stand-up pouch packagers with the flexibility of handling a range of packaging configurations and pouch sizes.
The new Totani model BH-60HVLLSC zipper-seal, stand-up pouch attachment from Amplas (Green Bay, WI) incorporates two high-speed bag making systems running concurrently to produce three-side sealed, bottom-gusseted, zippered stand-up pouches.
Hyde Park Electronics (Dayton, OH) has introduced level-control, analog-output sensors. Superprox® Model SM506A-400 (cable style) and Model SM556A (connector style) are noncontact sensors with a sensing range from 2" to 79".
John R. Nalbach Engineering Co. (Countryside, IL) has released a brochure describing its Necoflo G4 family of powder and granular fillers. The Necoflo G4 Rotary High Speed Volumetric Filler handles rigid containers from 2" to-63/16" dia at speeds from 140 to 480 cpm.
Placon (Madison, WI) has developed The Placon 2000(TM), an assembly system that packages products in clamshells or blister cards. It performs multiple packaging functions in one high-speed line, and can be custom configured to include denesting or card insertion, in-line filling, p-s labeling, sealing, overwrapping, coupon insertion, bar code testing, pick-and-place and pack out.