Arpac's (Schiller Park, IL) new high-speed shrink packaging equipment can collate and wrap up to 2ꯠ unsupported cans or bottles/min to produce up to 100 multipacks/min, using either plain or preprinted film.
Dow Plastics' (Midland, MI) Ethafoam(TM) LDPE line of foam has been expanded to include four new products for packaging electronics components. Ethafoam Nova is water-resistant and suited for applications with static loadings of 0.3 to 1.0 psi.
Marq Packaging (Yakima, WA) has redesigned the drive system of its Model 2000 case erector bottom sealer to use top and bottom flight lugs for transferring cases through the machine instead of a case pusher.
Rennco, Inc. (Homer, MI) releases a new colorful brochure to display its full line of packaging machines and systems. Many optional attachments are also shown such as the low-profile shrink tunnel, several infeed and discharge conveyor systems and many other special options to efficiently handle specific packaging problems.