The Spectrum II Cleanroom Series is suitable for dispensing processes that are often done in a cleanroom such as wafer-level underfill dispensing, 3D packaging, chip encapsulation, dam and fill, dispensing thermal compounds, and MEMS wafer capping.
A 600mm wide footprint and modular design allows easy adaptation and upgrading to accommodate new applications and production requirements such as pre- and post-queue stations, dual valve dispensing, and tilt jetting.
The series includes features such as a stainless steel system enclosure for easy wipe-down and maintenance and ULPA filter for down-flow ventilation for work-piece cleanliness. New Fluidmove v6.0 software features (running on Windows 7 Operating System) reduce operator dependency and training requirements to achieve consistent machine-to-machine performance.
Accurate and repeatable X-Y dispensing enables smaller keep-out-zones (KOZs) to accommodate high-density packages, while precision Z-axis control enables tighter dispense gaps for thinner lines and smaller dots. The dispensing system offers many built-in closed-loop process controls such as an integrated weight scale, software-controlled fluid and pressure regulators, the capability to manage up to six heating stations, and patented calibrated process jetting (CPJ) and mass flow calibration (MFC) to automatically ensure volumetric repeatability during long production runs. These controls help guarantee a reliable dispensing process that maximizes the total cost of ownership.