Three Yellow-shirted students took home new iPads, courtesy of contest sponsor ASCO Numatics.
PMMI, The Association for Packaging & Processing Technologies hosted the annual event at Pack Expo Las Vegas 2013, which PMMI owns and produces.
The Yellow team — Abbey Phillips from Rochester Institute of Technology (RIT), Katie Thompson of Clemson University, and Brian Wells of Rutgers University — won with a mixture of strategy and skill, perfecting a balance of completing tasks and reaching the most exhibitors.
In second place was the Red team: Jasmine Tompkins, RIT; Gregory Wee, Cal Poly San Luis Obispo; and Anggie Feliz, Rutgers. The Green team won third: Diane Jones, Rutgers; Jack Mullen, Cal Poly San Luis Obispo; and Florin Mustata, Purdue University Calumet.
“The students had a great time, competing and learning new skills. While they were here at Pack Expo, they got to see where their packaging degrees can take them and to consider new ideas for their careers,” says Maria Ferrante, vice president, Education & Workforce Development, PMMI.
The 21 participating exhibitors were spread out over the more-than-670,000-net square foot exhibition. Thanks go to: 3M; ADCO Manufacturing; Arrowhead Systems, Inc.; Bosch Packaging Technology, Inc.; Collamat AG; Con-Pearl NA, Inc.; Cozzoli Machine Company; Dorner Mfg.; Emulate3D Ltd.; FilmLOC, Inc.; Garvey Corporation; Intelligrated Systems; Labeling Technology Inc.; Langguth America; Millwood Incorporated; Morrison Container Handling Solutions; Packsize, LLC; Schneider Packaging Equipment Co., Inc.; Shurtape Technologies, LLC.; Spee-Dee Packaging Machinery; Starview Packaging Machinery, Inc.
“We often say Pack Expo is the world’s largest classroom for packaging and processing technologies, and thanks to the participating exhibitors — especially ASCO Numatics, which sponsored the contest — we were able to provide the students hands-on experience like none they’ll get anywhere else,” Ferrante says.
Seven PMMI Partner Schools were on board for the contest: Cal Poly San Luis Obispo, Clemson University, Purdue University Calumet, Rochester Institute of Technology, Rutgers University School of Engineering, San Jose State University, and Virginia Tech.