Packaging Automation Forum 2007
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Make2Pack Workshop Program

Make2Pack

Packaging Automation Forum 2008
Chicago Marriott Schaumburg
Monday, May 19, 2008

1:00 – 5:00 pm       Make2Pack Workshop and Connect-and-Pack™ Demo

Dave Chappell, Chairman Make2Pack and Former Corporate Technical Section Head at Procter & Gamble; joining Dave will be several technology providers with Connect-and-Pack™ demonstrations.

Workshop/Demo Fee:         $325

Make2Pack Workshop

Workshop attendees will learn the "intent" of the standards that will be used by industry to develop and support factory floor automation. As these new standards gain acceptance, they will impact and improve your manufacturing operation. This educational session will better prepare you to benefit by these evolving changes.

Learn from those who helped to create these new concepts and approaches. As Workshop Facilitator, Dave Chappell will share his comprehensive knowledge of Make2Pack standards in an optimum learning environment. Class size will be limited to encourage personalized attention.

  • Gain a better understanding of the intent of the standards
  • Understand how they can affect and benefit your operation
  • Learn more about implementation details

Connect-and-Pack™ Demo

Workshop attendees will get a brief overview of the Connect and Pack Demonstration followed by a "hands-on" session. The demonstration is meant to educate and inform the packaging community about the ease of integrating various packaging line functions (control, HMI, MES) when utilizing the OPW Connect-and-Pack™ guidelines.

Connect-and-Pack™ guidelines make packaging operations more effective by simplifying customization and integration, which enables world class packaging operations. When implemented, packaging companies and their partners gain a competitive advantage as they leverage an integrated supply chain to optimize operations.

During the "hands-on" session attendees will get an opportunity to see how the participating technology providers will be implementing one or more of the functions (control, HMI, MES) utilizing the Connect-and-Pack™ guidelines. Each technology provider will show:

  • How PackML and PackTags are implemented on their system
  • How OPC is configured to enable PackTags to be communicated to other demo applications (control, HMI, MES)
  • What documentation is provided for aiding in implementation of the Connect-and-Pack™ guidelines
  • What templates are provided for simplifying the configuration of a Connect-and-Pack™ application

The following technology providers will have Connect-and-Pack™ hands-on demonstrations:

Acumence
B&R
Beckhoff
Elau
GE Fanuc
Kepware
Wago

PLEASE NOTE: The Make2Pack Workshop is available for Packaging Automation Forum registered attendees only and requires an additional registration fee. Attendance is limited. (Program as of 1/15/08.) Register now.