Plan to attend
Packaging Automation Forum 2009,
March 31st at the InterContinental Chicago O'Hare.

Now in its fourth year, this popular educational and networking event features
peer-to-peer education about how to drive profit through controls and information technology. Packaging and automation professionals
enthusiastically endorse this one-day conference:

"an excellent forum to understand where technology is going"

"good presentations which demonstrate long overdue collaborations of
[IT, automation, and engineering] plus vendors”

"excellent real examples of how manufacturing is improved by
changes in control engineering"

Produced by Packaging World and Automation World magazines, this acclaimed event will feature exclusive presentations you won't find anywhere else.
Watch this space for agenda details – coming soon!

see past attendee list

Who Should Attend Packaging Automation Forum:

• individuals who use or purchase packaging machinery and systems
• packaging machine builders or OEMs
• professionals who want to learn more about today’s packaging technologies