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PACKAGING AUTOMATION FORUM 2010
TUESDAY, MAY 4 •
INTERCONTINENTAL CHICAGO O'HARE
Packaging Automation Forum, now in its fifth year, features peer-to-peer education about how to increase
productivity, flexibility and performance using state-of-the-art packaging controls and information
technology. This popular industry event provides a unique, focused learning and networking environment for
designers, specifiers and buyers of packaging machinery and systems. Attendees will learn about products,
technologies and strategies that can drive profitability and performance.
SEE
COMPLETE PROGRAM
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Who Should Attend:
- individuals who use or purchase processing and/or
packaging machinery and systems
- packaging machine builders or OEMs
- systems integrators
- control engineers and automation engineers
- manufacturing systems/IT and networking professionals
- operations/engineering management
- software development engineers in the CPG, food,
beverage or pharma industries
Registration Fee:
Early bird rate through March 31: $599 | Regular rate: $699
REGISTER NOW
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Make2Pack and
Connect-and-Pack™ Workshop:
We're pleased to again be offering an optional Make2Pack and Connect-and-Pack™ Workshop, scheduled
for the day before Packaging Automation Forum, on May 3 from 1 until 5 pm at the InterContinental Hotel.
WORKSHOP DETAILS
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To receive event alerts, or
sponsor information
, please email Sue DaMario at damario@packworld.com
with PAF 2010 in the subject line.
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