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Packaging World     VP/Editor, Pat Reynolds
SPONSOR: Misumi February 25, 2011 | Edited by Pat Reynolds

Free 2011 MISUMI Metric Catalog >>

MISUMI Introduces its New 2011 Metric Configurable Components Catalog, Complete With At-A-Glance Technical Specifications, Pricing and Delivery Times. Click this ad to order your free copy.


Free gift card from MISUMI with your first purchase >>

First-time customers placing an order through MISUMI's Web Ordering System can enter a promotional code to receive an American Express Gift Card. Click this ad for more information on this limited time offer.


Free eBook download on MISUMI configurable components >>

The eBook explains how to design systems incorporating configurable components to boost efficiency and minimize your reliance on custom parts. Example exercises include the design of a linear actuator and details on how to specify one unique, application-specific locating pin. Click this ad to get your free copy.


Free Webinar Download - MISUMI Aluminum Extrusions >>

This Webinar presentation entitled "New Product Focus: Aluminum Extrusions, Brackets and Hardware" will focus on the selection of Aluminum Extrusions and Accessories, focusing on the user's specific application requirements. Click this ad to download webinar.


Free Case Study - Motorized rotary lift workstation >>

High precision, ultra-rigid aluminum extrusions provides strong, lightweight framework, helped streamline design and manufacturing for Excitron Corporation. Excitron has designed and built motorized products for various government agencies such as NASA, the EPA and D.O.D. Click this ad to download case study.


Nestlé to describe how it wants packaging machines programmed

If optimizing manufacturing operations is anywhere on your list of things to do, be sure to attend the sixth Packaging Automation Forum April 26 in Chicago. Sponsored by Packaging World and sister publication Automation World, this unique event features peer-to-peer education about how to increase productivity, flexibility, and performance using state-of-the-art packaging controls and information technology.

Professionals from Nestlé, Frito-Lay, Kraft, Rich Products, and other leading companies will be presenting at this year's event to demonstrate how emerging technologies are optimizing manufacturing and packaging operations. Nestle's Bryan Griffen, electrical and automation engineering group manager who is based at Nestle headquarters in Vevey, Switzerland, is sure to command the attention of the audience at this event. He'll be describing a significant change in focus now underway at the world's largest food and beverage company wherein packaging line efficiency is being carefully examined to see how it might make a better and more consistent contribution to the bottom line. Right in the middle of this entire initiative is PackML, or, as it is more officially known, the ISA-TR88.00.02 PackML Standard.

"We've come to realize that in order to improve the bottom line, in order to drive effectiveness and efficiency in our operations, we need to take a more active and direct role in defining what packaging equipment should look like," Griffen tells Packaging World. "We want to make it clear that on the process side of things, where we own the technology, we will continue to be very dogmatic about whom we will use for process automation and how it will be used. But when it comes to packaging, it's the OEMs who build the machinery, not us. We are now saying look, we'd like you to use this international standard called PackML. We'd like to implement PackML in a way that lets us do two things. First, connect your machine with someone else's machine in one of our packaging lines. And second, get information out of our packaging machines and into our MES systems so that we have better business visibility. We have several approved PLC suppliers that you may use. Just make sure that you implement it with PackTags according to the PackML State Model. Our goal is to avoid exorbitant integration costs and to avoid having systems that don't let us move data readily into the MES layer."

To learn more about the Packaging Automation Forum and the half-day training session covering Make2Pack and the Connect-and-Pack standards, visit The early bird registration ends March 25.       


NEW Automation Products

Sensor housed in tough plastic

The W9-3 photoelectric sensor from Sick is a third-generation, high-performance sensor in an extremely tough plastic housing. The sensor has a wide variety of options to choose from including sensing range, mounting, and connectivity.... Read more

Compact EtherNet/IP bus coupler

Beckhoff's low-cost BK9055 compact bus coupler couples EtherNet/IP with the company's modular bus terminal system, which offers more than 400 different signal types. . ... Read more

Vision sensor inspects 6,000 parts/minute

The Checker® 4G Series of vision sensors from Cognex offers powerful and easy-to-use setup and comes with Ethernet networking for remote setup and monitoring, PLC communication through EtherNet/IP and PROFINET, and the ability to save inspection images to an FTP server. ... Read more

Real-time web-based information portal

GE Intelligent Platforms' latest version of Proficy® Real-Time Information Portal is a web-based solution that allows executives to easily and interactively visualize, report and analyze data in a secure environment, from virtually any location. ... Read more

Support-arm mountable panel PC

The 15-in. Panel PC 725 from B&R is a robust and well-protected HMI solution for use directly on the machine. Installation on a support arm system permits a flexible mounting position and ergonomic operation, even in tight spaces. ... Read more

Position sensors for harsh environments

Novotechnik's TX2 Series of linear position rod-style sensors is rated at IP 67 to protect from dirt, dust, and humidity. Available from stock in 8 stroke lengths from 25 to 300 mm. ... Read more

Sustainable Packaging Symposium


Innovation Starts At ProMat® 2011

See and compare solutions for your manufacturing and supply chain operations and network with your peers at ProMat 2011 March 21-24, 2011 at Chicago's McCormick Place. Discover equipment and systems solutions. Learn about the latest innovations. Explore 700 exhibits and 80 Education Sessions. Learn more >>

Upcoming events:

Sustainable Packaging Symposium
Hyatt Regency Chicago, IL. Sustainable Packaging Symposium, produced by Greener Package and the Institute for Sustainability, will examine the pivotal role of packaging in implementing sustainability across businesses' supply chains, from March 16-18.

NACD 2011 Annual Convention
La Quinta Resort & Club, Palm Springs, CA The National Association of Container Distributors (NACD) annual convention will be held April 6-10, 2011.

Packaging Automation Forum
Westin O'Hare, Rosemont, IL. Packaging Automation Forum, produced by Packaging World and Automation World, features peer-to-peer education about how to increase productivity, flexibility and performance using state-of-the-art packaging controls and information technology, April 26.

Healthcare Packaging Conference & Workshops
Westin Princeton at Forrestal Village, Princeton, NJ. Healthcare Packaging Conference & Workshops, produced by Healthcare Packaging magazine, will feature operational and package design strategies for pharmaceutical and medical device packagers, May 26.

Bryan Griffen


Nestlé is passionate about PackML ... learn why at this year's Packaging Automation Forum.

Direct from Nestlé HQ in Vevay, Switzerland, Bryan Griffen will speak at this year's Packaging Automation Forum. Nestle's Engineering Group Manager will share his enthusiasm about the benefits of PackML for CPG manufacturers. Hear Nestlé and five other educational sessions on controls and information technology that can drive performance, efficiency, safety and profits. Plan now to attend on April 26 at the Westin O'Hare in suburban Chicago.

Learn more >>

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