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Packaging Summit Expo and Conference 2007 emphasizes container and material innovations

The Packaging Summit Expo and Conference, scheduled for May 15-17, 2007, at the Donald E. Stephens Convention Center in Rosemont, Illinois, will include even more materials and containers innovations pertinent to real-world applications – information and concepts tailored specifically for a multitude of packaging needs.
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Packaging materials / components on display include:

- adhesives

- desiccants

- labels

- sleeves

- tags

- protective packaging

- resins

- coatings

- additives

- inks

- tape

- film

- closures

- lids

- pumps

- sprayers

- fitments

- paper / paperboard / corrugated

- glass

- metal

- plastic

- …and all combinations

In addition the World Packaging Organization (WPO) will be holding its WorldStar Ceremony at the Packaging Summit Expo and Conference honoring the best packages from around the world. This will mark the first time in more than a decade that the WPO has held its WorldStar ceremony in the United States.

As a fully integrated expo and conference attendees will not only gain knowledge but will have ample time to explore the show floor to find the containers and materials solutions they are looking for. Top-level companies will be ready to serve designers product manufacturers retailers and brand owners while connecting with appropriate packaging decision-makers.

If your business requires innovative containers and materials solutions as drivers for success the Packaging Summit Expo and Conference is a "must-attend" event for 2007.

For more information visit www.pkgsummit.com.

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