- Contract Packaging
- Leaders in Packaging
Article | August 11, 2011
Telesis Technologies, Inc: Laser marking system
The Telesis EVC Laser from Telesis Technologies marks “on-the-fly” at high speeds without burn thru on delicate foils and with contrast on various plastics, as well as fast marking on chip boards, plastic bottles, and other materials without consumables or ecology issues.
The small-footprint system allows VANADATE laser technology to enter the “Green Space” required by the latest packaging mandates. Features a Q-switched Nd: YVO4 end-pumped laser design with a remote fiber-coupled diode pump source. Operates where shock, vibration, and dust are a concern. Features deep focal tolerance, high-quality small beam diameter, air cooled-no chiller required, stable output power. Integrated PC with touch screen interface, Merlin LS AMI “scan and go” software, quick-posts, and encoder controls are also available.
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