- Contract Packaging
- Leaders in Packaging
Article | January 31, 2003
Hoffman (Anoka, MN) introduces its A26 Low Profile disconnect enclosure series. According to the company, it’s the only off-the-shelf enclosure line that supports the maximum 60”-height requirement of the ‘Lean’ manufacturing doctrine.
Enclosures are sized to provide a clear line of sight across the factory floor. The A26 Series is a direct response to manufacturers’ need for smaller shorter enclosures for distributed control components and condensed main control and power distribution panels.
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