- Contract Packaging
- Leaders in Packaging
Article | April 6, 2009
Balluff: Thru-beam sensor technology
Balluff's UltraFrame™ self-contained thru-beam sensor technology provides error proofing, process monitoring, and general automation tasks in a number of environments.
The UltraFrame sensors’ one-piece housings contain both emitter and receiver elements with pre-aligned optics, providing easy installation and an end to misalignment. On-board sensitivity and light/dark operation controls allow easy adjustment. With a broad selection of sizes, shapes, and light sources, the sensors are available in four basic frame designs. Up to four application-specific light sources are also available including: visible red (easy set up), pinpoint visible red (higher precision), visible red laser (highest precision), and high-power infrared (burns through accumulated dirt).
Related Sponsored Content
E-Book Special Report
Total Cost of Ownership
Sign up to receive timely updates from our editors and download this E-Book Special Report to learn how to calculate the true Total Cost of Ownership (TCO) of your packaging machinery.