- Contract Packaging
- Leaders in Packaging
Article | August 31, 1999
Hyde Park Electronics: Thru-beam sensor
Microsonic® 800 Series flat-profile, ultrasonic, thru-beam sensors from Hyde Park (Dayton, OH) can detect irregularly shaped objects and objects with poor reflective or fully sound-absorbing surfaces.
Can be used on conveyors to detect objects of all colors at speeds exceeding 2 packs/min with sensing ranges to 40".
Related Sponsored Content
E-Book Special Report
Total Cost of Ownership
Sign up to receive timely updates from our editors and download this E-Book Special Report to learn how to calculate the true Total Cost of Ownership (TCO) of your packaging machinery.