- Contract Packaging
- Leaders in Packaging
Article | August 31, 1996
Turck (Minneapolis, MN) has announced the busstop(TM) input/output module for DeviceNet(TM) networks. The module is designed to connect standard input/output devices to a "bus," which is the communications system linking electrical components in a packaging line.
It's specifically designed for use with two photoelectric sensors with alarm outputs and drives up to two discrete output devices. Inputs automatically detect a sourcing (PNP) or sinking (NPN) open-collector signal.
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