- Contract Packaging
- Leaders in Packaging
Article | March 27, 2012
Wago Corporation: IO-link module
WAGO’s 750-675 4-Channel IO-Link Master Module simplifies integration, configuration and management of intelligent sensors and actuators.
Utilizing the IO-Link Standard jointly developed by suppliers, the 750-675 eliminates configuration of field devices via proprietary handheld units. The module also reduces device wiring to three conductors, minimizing automation footprint, engineering, commissioning and maintenance costs.
The 12mm-wide 750-675 integrates IO-Link below the control level for point-to-point linking of field devices to the company’s I/O-system. The module provides centralized network-based configuration for devices from multiple vendors via WAGO-I/O-CHECK configuration software and WAGO-I/O-SYSTEM coupler or controller. The network-independent 750-675 functions as a gateway from I/O-Link to any major fieldbus for interoperability.
Network-based configuration replaces proprietary handheld configuration units and required training to streamline machine-building and control applications for industries such as packaging, food/beverage and pharmaceutical. 750-675 also economizes device maintenance, minimizing service for difficult-to-access applications. The I/O-Link Module bolsters application reliability via vibration-proof and maintenance-free CAGE CLAMP Spring Pressure Connection Technology. CE Conformity, UL/cUL (UL 508) and Electromagnetic Immunity (EN 61000-6-2) approved.
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