- Contract Packaging
- Leaders in Packaging
- Calendar of Events
This content was submitted directly to this Web site by the supplier.Article | January 31, 2013
GE Intelligent Platforms: Modules
COM Express modules deliver high performance and reliability in multi-display applications.
GE Intelligent Platforms announced the latest addition to the company’s growing range of COM Express modules with the launch of its highest performance offering to date, the rugged bCOM6-L1400.
Taking advantage of the significant processing and graphics capabilities of the recently-announced Intel® Core™ i7 processor, the bCOM6-L1400 can support multiple independent displays in a wide variety of commercial, industrial, transportation and defense applications in a broad range of embedded computing environments.
The launch of the bCOM6-L1400 further expands GE’s range of rugged COM Express solutions following a series of announcements. The most recent of these was the launch of the rugged bCOM6-L1200 – which features a range of five VIA Nano™ and VIA Eden™ processor options.
By separating the carrier card from the processor, the COM Express architecture extends the useful life of the subsystem by allowing simple, cost-effective upgrade of the processor alone. This reduces long term cost of ownership while ensuring that performance keeps pace with changing needs.
Offered with a choice of either a dual-core or quad-core processor for maximum flexibility and enabling customers to select the optimum price-performance/watt combination for the planned application, the bCOM6-L1400 takes advantage of GE’s extensive experience and expertise in the design and development of rugged COM Express modules. It also complements GE Intelligent Platforms’ extensive portfolio of rugged embedded computing solutions that includes single board computers, multiprocessors, Ethernet switches, displays and networking.
The bCOM6-L1400 can be confidently deployed in the harshest, most challenging environments that are subject to extremes of temperature, vibration, shock and contaminants. Its components are specifically selected for reliable operation in hostile environments, and the processor and memory are soldered to the board for the highest possible resistance to external forces.
Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes. Sophisticated dynamic thermal management optimizes uptime and helps prevent damage to the system.
GE is able to provide customers with the support necessary to enable them to develop their own carrier card configurations, or to provide custom carrier card variants on request. This ability provides significant flexibility to systems integrators looking to create unique, high value-added solutions.
As well as its graphics capabilities (VGA, LVDS with dual channel support and SDVO/TMDS/DisplayPort over DDI), the bCOM6-L1400 features up to 8GBytes of DDR3 memory, Gigabit Ethernet and four SATA interfaces, with support for both RAID 0 and RAID 1. Also provided for optimum connectivity are eight USB 2.0 ports and four USB 3.0 ports.
E-BOOK SPECIAL REPORT
42 Best Package Designs
Sign up to receive timely updates from our editors and download this e-book consisting of our editors' picks of most notable package designs. Updated for 2014!