- Contract Packaging
- Leaders in Packaging
Article | October 18, 2010
Balluff: I/O and RFID connectivity for CC-Link
Balluff’s IP67 CC-Link I/O modules and supporting cordsets provide a full I/O and RFID connectivity solution for CC-Link, and enable the consistent, cost-optimized implementation of requirements using decentralized installation technology.
The IP67 CC-Link I/O modules can be used to simplify the way most CC-Link I/O Networks are run by placing the modules near the concentration of sensors and actuators. The smaller footprint and ease of setup reduces installation material costs and labor, as well as decreases maintenance troubleshooting and repairs. Product features include: I/O Module; unique push-button display allows for easy configuration right at the block; IP67 rugged metal housing that withstands harsh industrial environments; ports that accept 2- or 3-wire inputs; cordsets and accessories; auxiliary power cordsets and more.
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