Article |

Balluff: Distributed modular I/O for industrial ethernet

Balluff’s new generation of distributed modular I/O can be used in a cost effective way to replace standard slice I/O and distributed I/O solutions.  
Print Reprint
Provides expandable architecture for EtherNet/IP and PROFINET controls applications and offers IP67 protection and industry standard connectors. Using standard 3-conductor cables, up to 4 slave devices can be connected to each master block, which communicates over the industrial Ethernet network to the controller.  Instead of a backplane, each I/O device is connected to an industry-standard M12 port, creating an IP67 connection.  With the ability to be installed within a 20-meter radius from the master device, slave devices can be easily distributed across the machine.   

Related Sponsored Content

The 2014 Packaging Trends Report
Sign up to receive timely updates from our editors and download this e-book consisting of our editors' picks of most notable package designs. Updated for 2014!


Don't miss intelligence crucial to your job and business!
Click on any newsletter to view a sample. Enter your email address below to sign up!
Each newsletter ranges in frequency from once per month to a few times per month at most.