A recent meeting of the OMAC Packaging Working Group’s PackML and PackSpec committees concentrated on clarifying and simplifying its standard to bolster increased acceptance and use of the standard by OEMs and end users.
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PMMI has an unflagging commitment to education and workforce development, and with the help of the PMMI Education and Training Foundation provided travel scholarships to 170 students and instructors coming out to PACK EXPO.
Packaging World and TricorBraun will donate a $2500 tuition scholarship to Missouri University of Science and Technology; The “Future Leaders in Packaging” scholarship is an annual award that is part of Summit Media Group’s Leadership in Packaging program.