Representatives from the three organizations involved in developing the apprenticeship program join the first four apprentices on the bridge that connects Bosch’s New Richmond, WI, facility grounds and the Wisconsin Indianhead Technical College campus. Back row L-R:  Nancy Cerritos (WITC); Kevin Lipsky (WITC);  Pres Lawhon (Bosch); Olaf Wick (WITC); Randy Deli (WITC). Middle row L-R:  Travis Ludvigson, (State of Wisconsin Bureau of Apprenticeship Standards); Alexandra Nungesser (

WITC, Bosch aim to bridge the skills gap

Newly initiated joint venture includes electro-mechanic apprenticeship—the combination of an electrician and mechanic—that’s the first of its kind in Wisconsin and is now considered a new trade.
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The Automation Conference May 20-21 in Chicago celebrates the resurgence of manufacturing in the U.S.

Chicago conference to focus on how automation drives efficiency across industries

The Automation Conference this year celebrates the resurgence in manufacturing with two days of educational sessions covering industrial automation as a key driver of efficiency.

2014 Packaging Scholarship announced

The recipient of Packaging World’s 2014 Future Leaders in Packaging Scholarship is the Packaging Program at Virginia Tech, Blacksburg, VA.
Feature Article

12 topics for effective support agreements

Doing business with a new machinery or controls provider is a long term commitment for both parties.

Machinery and mechatronics education comes of age at Pack Expo

Keith Campbell observes a tectonic shift--for the better--that has occurred in the educational pavilion at Pack Expo.

The amazing race at Pack Expo

On Wednesday, Sept. 25, The Amazing Packaging Racers took to the Pack Expo Las Vegas show floor for the fourth year running.
Big workforce training grant goes to Purdue Calumet.

Purdue Calumet receives $2.7+ million grant

Purdue University Calumet’s impact on northwest Indiana economic development stands to be further enhanced.
Packaging track added to Process Expo.

New packaging technologies featured at Process Expo

Just announced is an important addition, “Packaging in the new Millennium,” to the packaging track of the Process Expo University educational program taking place at Chicago's McCormick Place from November 3-6, 2013.
The cover of “Global Nano Packaging Market 2013-2023: Opportunities for Nanotechnology,” from Visiongain Ltd.

Report assesses global nanotechnology packaging market through 2023

Global consumers, economic issues, emerging markets to influence nanotechnology growth in packaging in the coming decade.
Purdue Calumet's BS in Mechatronics Engineering Technology Program has received the full accreditation by ABET.

News from Purdue U. Calumet

Niaz Latif, Professor and Dean of the College of Technology at Purdue University Calumet, has announced that enrollment in the Mechatronics program has increased from 22 in the Fall of 2012 to 50 in the Fall of 2013.


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