Smart/active packaging

News

| February 26, 2013

Messe Dusseldorf and ESMA join to address printed electronics

The German trade fair organizer Messe Düsseldorf and ESNA (European Association for Specialist Printing Manufacturers of Screen, Digital and Flexo Technology) have formed a strategic cooperation in order to address the fast-growing printed electronics market and its huge potential in a wide range of sectors.

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The E-Packaging Market in 2023, % of number of units by function type. Source: IDTechEx

News

| February 13, 2013

Smart packaging to grow from $75 million to $1.45 billion in 10 years

New report suggests that printed electronics are the enabling technology that will propel a rapid growth in smart and intelligent packaging through 2023.

News

| January 22, 2013

McDonald's launches new global packaging designs

Bags and cups to feature QR codes providing access to finding nutrition information.

Dr. Jay Singh, professor and packaging program director at Cal Poly.

Feature Article

| October 4, 2012

Highlights of the 18th IAPRI World Packaging Conference

A record 24 countries were represented at the recently completed IAPRI World Packaging Conference as this year’s host, the Packaging Program at Cal Poly, celebrated its  25 anniversary.