A line of robotic palletizers and depalletizers from APG (Fairfield, NJ) and Samsung includes robots that palletize up to four pallets simultaneously, operat-ing at 15 cycles/min while carrying two or more products per move.
Maker of computer networking gear forms a Global Packaging Initiatives Team to create global packaging standards. This "best practices" blueprint aims to cut costs and unify 3Com's packaging worldwide.
Kisters (Erlanger, KY) will present its layer pattern packing system called PackRouter. Capable of arranging multipacks in layers, the system is said to eliminate the need for additional transit packing.
Soco System (Waukesha, WI) presents a new generation of high-performance IPC robotic palletizers, equipped with modern IPC control. Four-color touchscreen permits easy operation and simple in-plant programming.
Soco System's (Waukesha, WI) Pallet Robot has a manifold design that eliminates fragile tubes and fittings. The plate on which the head's vacuum pads are mounted is made as a "sandwich" construction where air is in the plate.