Keith Campbell, a Packaging World Contributing Editor and On the Edge blogger, took in the sights and sounds of Dusseldorf this past May to bring us a series of reports on new developments in the packaging controls and automation space being shown at interpack 2014. In case you missed his written, blogged, or podcast contributions, here are a few highlights.
E-BOOK SPECIAL REPORT
42 Best Package Designs
Sign up to receive timely updates from our editors and download this e-book consisting of our editors' picks of most notable package designs. Updated for 2014!
The 2012 International Packaging Conclave in Greater Noida, India, recorded a resounding success, bringing together 110 participants – including top managers from some of the most prominent end-user companies in the food, beverage and pharmaceutical industries.
It seems like it was not so long ago that there was a serious debate over whether or not wireless sensor networks — and wireless communications in general — were a technology suitable for industrial applications. If you take a look around, that debate is over.
Nestle’s Bryan Griffen delivered an update on OMAC Packaging Workgroup initiatives at the Automation Conference, held in Chicago May 22-23, providing a view of the benefits to come with the new standard.
The first annual Automation Conference, bringing together process, discrete and packaging professionals in one conference, kicked off this morning with keynotes speakers from Boeing and ExxonMobil. The conference runs from May 22-23 in Chicago, IL.
The Automation Conference's (www.automationworld/tac2012) second day keynotes touched on automation standards, holistic manufacturing training and an update from Dr. Bryan Griffen on Nestle's continued focus on packaging automation and PackML developments.