ID Technology, a division of Pro Mach and a leading provider of labeling, coding and marking solutions, has released the COM II – a versatile thermal transfer overprinting solution for flexible packaging in high volume manufacturing environments.
Ossid, booth S-958, introduces its new CS100 case scale—an NTEP-certified case scale that operates and changes over with ease, offers a range of data management advantages, and achieves up to 45 case-per-minute throughput.
Pro Mach, Inc. booth S-956, launched ProCustomer one year ago, a new initiative designed to ensure that customers maintain peak packaging system productivity through best-in-class standards in aftermarket parts, service, and support.
OYSTAR IWK is introducing its new TFS E tube filler at Pack Expo 2010 in Chicago. This machine features innovative solutions that greatly reduce product changeover times. It also served as a pilot project for international collaboration between IWK and Schneider Electric, in which Schneider Electric served as both an international technology partner and a supplier of automation and electrical equipment.