Balluff's (Florence, KY) BOS 20K fiber-optic sensor uses teach-in capability to eliminate adjustment hassles and offer accurate sensor set-up. The versatile sensor has a compact 60 x 30 x 13 mm housing and is suitable for small parts detection, part feature checks, counting, and part positioning.
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The H-100 E automatic bagger from Automated Packaging Systems (Streetsboro, OH) offers an anti-jam mechanism that implements sensors to stop the machine if a part is detected in the seal path of the unit.
The LC-104 color sensor from Sentex (Santa Clara, CA) permits rapid analysis of up to four color signatures. Offers three levels of sensitivity that can be adjusted according to the shades of colors to be read.
efector Inc. (Exton, PA) has released a new family of master controller modules, slave modules, power suppliers, cables, software and accessories that will allow supplier's sensors and switches to be connected on a simple, two-wire bus system.
Parker Hannifin, Pneumatic Div.'s (Richland, MI) Serial Addressable Manifold (SAM) Generation 3.0 is a communications module that allows valves, sensors and other devices on a packaging machine to communicate on a device-level network.
Designed for packaging line and machine applications, the new Model SM600 Flat-profile Series ultrasonic proximity sensors from Hyde Park (Dayton, OH) detect objects as small as 0.06" at a distance of 1.5" at speeds of 2ꯠ/min.
Banner Eng.'s (Minneapolis, MN) 1998 catalog of photoelectric sensors is a 700-page book designed for engineers facing sensing problems. Company background, new products and detailed information on photoelectric and ultrasonic sensors and accessories are included.