Refill packs for Tide and Cheer laundry detergent garnered FPA's "Green Globe" award for 1994. Three other FPA winners were also big contributors to source reduction efforts.
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Performance-oriented packaging regs for hazardous material shipping are more sweeping than simply shifting to United Nations standards. Some changes relating to drum packages are being criticized.
Corrugated processing machine cuts and scores multiple case styles and sizes. It enables Boeing to produce cases on a J-I-T basis and frees up space once allocated to lot quantities of premade case blanks.
Quantum Chemical's (Cincinnati, OH) Petrothene® LT 6194-69 HDPE resin for blown film applications has good moisture barrier properties, low taste and odor characteristics and is easy to process.
DuPont's (Wilmington, DE) Clysar® poultry tray packaging system includes Clysar RS500 shrink film, the RS510 conversion kit for modify- ing existing Ossid 500 tray packaging equipment, and a hot water shrink tunnel that minimizes print distortion.
HICOR(TM) OHD is a one-side sealable oriented HDPE film from Mobil Chemical Films Div. (Pittsford, NY). It has good deadfold and directional tear characteristics and is suitable for use as an inner wrap in boxes of crackers, snacks and cereals.
The Hot Dot Bag from Bancroft Bag (West Monroe, LA) is a pasted valve bag that uses hot melt adhesive for superior sift resistance. For use with finely powdered foods and chemicals, the bag eliminates puffing of the product during filling, as well as sifting during handling.
Adhesives Div., National Starch and Chemical Co. (Bridgewater, NJ): Steve Pearce, mgr., special projects; Daniel O'Brien, sales rep., Pennsylvania area.
Winners of the 1994 AmeriStar Package awards were announced November 12 at a reception held in conjunction with Pack Expo in Chicago. Sponsored by the Herndon, VA-based Institute of Packaging Professionals, recipients in the Industrial Category included a multi-compartment paperboard container for pressure transmitters and a polycarbonate suspension system for silicon wafers.