Among the participants in a packaging machinery automation roundtable discussion that takes place tomorrow at The Automation Conference is Tom Doney, Nestle Engineering and leader of the OMAC Packaging Workgroup’s PackAdvantage committee.
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“We’re convinced that OMAC comes with a payback.”
Succinct and to the point, this comment by R&D equipment engineering manager Paul Redwood of Church & Dwight echoes the sentiments being expressed these days by engineering leaders and executives at a number of major Consumer Packaged Goods companies.