Article |
March 31, 2002
'Colder' hot-melt adhesive
A new, low-temperature, hot-melt adhesive from National Starch & Chemical (Bridgewater, NJ) has been introduced to improve safety and reduce energy costs.
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Typical operating temperatures range from 245?F to 265?F with 250?F as the target 100?F cooler than conventional hot-melt adhesive requirements company says. The Cool-Lok® 34-250A adhesive resists heat and cold during transport and storage and adheres to difficult board stock including recycled and high-performance liners.

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